Mga produkto
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OEM Pcba Customized Assembly Board Pcba Assembly Services
Application:Aerospace, BMS, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
Tampok: Fexible PCB, High density PCB
Mga Materyal na Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin
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OEM Intelligent Security PCB manufacturer
Mga Layer: 1-22 Layer
kapal ng board: 1.6 mm
Kapal ng tanso:1 OZ
Batayang materyal: FR4
Pinakamababang laki ng butas: 0.2mm
Minimum na lapad ng linya:4 mil
Tapos na ibabaw: walang lead na HASL
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OEM Fast 5 Single Ports Ethernet Switch Board 10/100M Hindi Pinamamahalaang Half-Full Duplex Lay2 PCBA Module
Ang HT-S1105DS ay isang mini compact soho 5 port 10/100mbps 4pin head network switch PCBA. Mayroon itong 5 10/100mbps 4pin head port na built-in. Plug n play, hindi na kailangang i-configure. Ang input boltahe 3.3V.
Ang power, link/act led indicators ay nagbibigay ng mabilis na trouble shooting solution. -
Mga LED lamp at lantern Surface Mount PCB Terminal Blocks
Numero ng Modelo: TC280
Kategorya: Surface Mount PCB Terminal Blocks
Mga Circuit: 2Pin
Kasalukuyang Rating: 3.0A
Rating ng Boltahe: 200V
Direksyon sa Pag-mount ng PC Board: Side entry -
Keyboard pcb board na ginagamit sa Medical Device na may BGA assembly na may ISO 13485
Mga Katangian ng Flame Retardant:V1
Mga Materyal na Insulation: Synthetic Resin
Materyal: Fiberglass Sheet
Mechanical Rigid: Fexible
Teknolohiya sa Pagproseso: Delay Pressure Foil, Electrolytic Foil
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Hot Air Leveling Multilayer PCB na may Apat na Layer
Application:Komunikasyon, Computer, Consumer Electronics, Home appliance, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
Tampok: Fexible PCB, High density PCB
Mga Materyal na Insulation:Epoxy Resin, Metal Composite Materials
Material:Fiberglass Epoxy Resin at Polyimide Resin
Teknolohiya sa Pagproseso: Delay Pressure Foil, Electrolytic Foil
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High Quality OEM Top PCB Laminate na may UL Certificate
Application:Aerospace, BMS, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
Tampok: Fexible PCB, High density PCB
Mga Materyal na Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin
Material: Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin at Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Teknolohiya sa Pagproseso: Delay Pressure Foil, Electrolytic Foil
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Mataas na kalidad na ENIG PCB para sa medikal na kagamitan Aerospace military defense area Kapal ng ginto 1u”-3u”
Kami ay gumagawa ng pcb at pcb assembly ng one-stop service factory. may kabuuang 400 tao. 20% tumaas ang dami ng benta bawat taon. 70% produksyon lahat mula sa ibang bansa. gumagawa kami ng 1-12layer.FR4.CEM-1.CEM-3.HDI. materyal ng AL.
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Mataas na kalidad ng pagpapasadya pcb manufacturing board electronic circuit pcb Communication module PCB
Aerospace, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
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FR4 HDi double sided electronic circuit board pcbs
Mga Katangian ng Flame Retardant:V0, V1, V2
Mga Materyal na Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin
Material:Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, Ang Paper Ring Gas Resin
Mechanical Rigid: Fexible
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FPC PCB Rigid Flexible multilayer
Tampok: Matibay Flex pcb
Mga Layer: Multilayer
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Ang Firmware Decode PCB Copy PCB Clone PCB software ay bumuo ng PCBA Reversing Engineering Service
Application:
Aerospace, BMS, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
Mga Materyales ng Insulation:
Epoxy Resin, Metal Composite Materials, Organic Resin
Materyal:
Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin at Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Teknolohiya sa Pagproseso:
Delay Pressure Foil, Electrolytic Foil
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