Application:Aerospace, BMS, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Mga Instrumentong Medikal, Motherboard, Smart electronics, Wireless charging
Tampok: Fexible PCB, High density PCB
Mga Materyal na Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin
Material: Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin at Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Teknolohiya sa Pagproseso: Delay Pressure Foil, Electrolytic Foil